1 cdsot323 series 25-nov-10 document no.32021 small signal switching diode, sot323 case CDBAV99W/ cdbav70w/ cd baw56w/ cdmmbd4148w features ? silicon epitaxial planar diode ? smd chip pattern, sot323 case, availa ble also in sot23 case ? leadfree and rohs compliance components ? for small signal switching and operat ing ambient temperature less than 55 o c and voltage withstand less than 60v; not suitable for ac switching inpu t as rectified circuit and high reverse voltage location. mechanical characteristics ? size: sot323 case ? weight: approx. 11mg ? marking: bav99 as anode to cath ode series dual switching diode bav70 as common cathode dual switching diode baw56 as common anode dual switching diode bd4148 as sot323 case single switching diode graphic symbol CDBAV99W cdbav70w cdbaw56w cdmmbd4148w dimensions dimension/mm sot323 l 2.00.2 w 2.10.2 t 0.850.1 c 0.550.2
2 cdsot323 series 25-nov-10 document no.32021 thermal characteristics 1) parameter at t amb =25 o c 1) symbol value unit 200 mw forward power dissipation power derating above 25 o c p tot 1.6 mw/ o c junction temperature t j 150 o c thermal resistance junction to ambient air r ja 625 o c/w operating& storage temperature range t stg -55 to 150 o c 1) valid provided that electrodes are kept at ambient temperature. maximum rating 1) parameter at t amb =25 o c 1) symbol value unit repetitive peak reverse voltage v rrm 75 v 150 2) ma average rectified current sin half wave rectification with resistive load i f(av) 130 3) ma repetitive peak forward current at t amb =25c i frm 200 ma non-repetitive surge forward current at t<1s and t j =25 o c 500 ma at t Q 8.3ms and t j =25 o c i fsm 1000 ma 1) valid provided that electrodes ar e kept at ambient temperature. 2) single diode 3) double diode electrical characteristics 1) parameter at t amb =25 o c 1) symbol value unit forward voltage at i f =10ma 0.855 max v at i f =50ma 1.0 max v at i f =100ma v f 1.25 max v leakage current at v r =75v i r 2.5 max ua capacitance at vr=0v,f=1mhz c tot 4 max pf reverse recovery time at i f =i r =10ma,r l = 100 t rr 6 max ns 1) valid provided that electrodes are kept at ambient temperature.
3 cdsot323 series 25-nov-10 document no.32021 typical characteristics figure 1. forward characteristic figure 2. power de-rating 0 100 200 300 400 500 0 20 40 60 80 100 120 140 160 180 200 tamb-ambient temperature/oc ptot-admissible power dissipation/ mw figure 3. forward current d e- rating figure 4. reverse vo ltage de-rating 0 100 200 300 400 500 0 20 40 60 80 100 120 140 160 180 200 tamb-ambient temperature/oc if/ ma . 0 50 100 150 200 0 20 40 60 80 100 120 140 160 180 200 tamb-ambient temperature/oc vr/ v . test characteristics test item test condition requirement solderability sn bath at 2455 o c for 20.5s >95% area tin covered resistance to soldering heat sn bath at 2605 o c for 102s v f ,v r & i r within spec; no mechanical damage humidity steady state at 85 o c 85%rh for 168hrs v f ,v r & i r within spec continue forward operating life at 25 o c i f =1.1i f for 1000hrs v f ,v r & i r within spec thermal shock -55 5 o c/5min to 1505 o c/5min for 10cycles v f ,v r & i r within spec bending strength bending up to 2mm for 1cycle v f ,v r & i r within spec; no mechanical damage
4 cdsot323 series 25-nov-10 document no.32021 applications ? function: suit for small si gnal switching application ? typical application circuit: ? typical product field: general applicatio n except high reverse voltage location ? soldering condition: soldering condition & caution recommended soldering condition (refer to ipc/jede c j-std-020d 4-1&5.2) recommended profile condition sn-pb soldering leadfree soldering wave soldering ramp-up rate (from pre-heat stage) <3 o c/s <3 o c/s t<150 o c pre-heat temperature & time 100-150 o c 60-120s 150-200 o c 60-120s 100-150 o c 60-120s soldering temperature & time 183 o c 60-150s 217 o c 60-150s 2605 o c 52s peak temperature 2305 o c <260 o c 2455 o c <260 o c 2605 o c time within 5 o c of peak temperature 10-20s 20-30s - ramp-down rate <6 o c/s <6 o c/s <6 o c/s time 25 o c to peak temperature <6min <8min - manual soldering: approx. 350 o c for 3s, avoid solder iron tip di rect touch the components body
5 cdsot323 series 25-nov-10 document no.32021 recommended soldering profile fig1: reflow soldering profile for lead-free solder (snagcu) fig2: wave soldering profile *1. the recommended profiles are referring to ipc/jedec j-st d-020d & iec-60068-2-58 *2. chip diodes are able to stand maximum soldering temperature up to 260 o c max for 10s, and the soldering cycles with max 3 ti mes, referring to iec-60068-2-58 t/s t/ o c t/s t/ o c
6 cdsot323 series 25-nov-10 document no.32021 ? storage condition: product termination solderability can degrade due to high temperature and humidity or chemical environment. storage condit ion must be in an ambient temperature of <40 o c and ambient humidity of <75%rh, and free from chemical. environmental characteristics hazardous substance or element/ppm pb cd hg cr 6+ pbb pbde product <1000 <100 <1000 <1000 <1000 <1000 halogen substance/ ppm f cl br i total product <900 <900 <900 <900 <1500 packing method quality/reel reel size tape product 5,000pcs 7? paper tape disclaimers these products are not designed for use in applicatio ns where any failure or malfunction may resulted in personal injury, death or severe property or enviro nmental damage such as medical, military, aircraft, space or life support equipments.
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